COMPANY

STRUCTURE

 CML Microsystems Plc Structure

Business units

CML Microcircuits is a leading authority in the design, manufacture and marketing of integrated circuits for two major sectors of the semiconductor industry: wireless communications and wireline telecoms. Headquartered in Essex, England, CML is a fabless semiconductor company with sales, marketing and technical support operations in North Carolina, USA and Singapore. The use of commercially available silicon processes (CMOS, BiCMOS, BiPOLAR, SiGe) allows CML to produce highly innovative, small size integrated circuits with high performance and ultra low-power consumption. Through many years' experience of designing both standard and full custom products, CML excels in producing innovative solutions containing mixed signal, RF, analogue, memory, digital and DSP design.


Sicomm Technologies is a fabless IC design house focusing on the development of RF PA, RF transceiver and baseband System on Chip (SoC) solutions for narrowband wireless communications. Since its inception in 2003, Sicomm has been dedicated to providing quality IC products for wireless communications, especially for FRS and PMR applications. Sicomm provides total reference design solutions for manufacturing high quality compact radio systems. Sicomm's products are widely used in consumer and professional radios alike, providing a reduction in cost and power consumption over competing solutions. Sicomm  actively participates in developing digital radio standards and is committed to providing high quality, cost-competitive IC’s to support the wide spread adoption of digital PMR standards.


Hyperstone GmbH is a fabless semiconductor company founded in 1990 and is based in Konstanz, Germany, with associated sales and technical support offices in Taiwan and the USA. The main product range consists of Flash Memory Controller IC’s built on Hyperstone's patented RISC/DSP architecture and targeted at global industrial solid state storage applications. Hyperstone controller IC’s form the bridge between the host microprocessor and commodity flash memory storage IC’s covering a range of standard interface formats (PATA, CF, SD, MMC, SATA, USB) and are used to manufacture storage products based upon a number of industry standard form-factors (CompactFlash, eSD, eMMC, MO-297, MO-300 etc.)